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Posted: 2025-04-16 21:45:45 UTC
This article contains some claims that remain unverified. While much of the content may be accurate, exercise care when relying on this information.
This article contains some claims that remain unverified. While much of the content may be accurate, exercise care when relying on this information.
Status
Last Updated
2025-04-16 21:46:00 UTC
Verified By
Rollup News
An ultra-thin loop heat pipe developed in Japan improves heat management in mobile devices, allowing for slimmer designs without compromising performance.
Enhanced heat management in mobile devices
Slimmer designs without sacrificing performance
Potential to redefine next-generation smartphones